Table is intended to show performance enhancement of switch ASICs -- arranged chronologically by announcement date. Cisco announces their new silicon along with its first products while merchant silicon manufacturers announce new ASICs perhaps a year before their customers are ready to ship first products. Where buffer is shown with a multiplier, the ASIC design is segmented into slices. Total packet buffer is the product of the numbers in the buffer column but only the segment amount is available to any one output port. |
ASIC | Announced | buffer | Geometry | Sw BW |
Cisco Cat3550 | Dec 2001 | 2 Mbyte | 8.8 Gb/s | |
HP Procurve ASIC | Mar 2003 | 0.5 Mbyte | 48 Gb/s | |
Broadcom BCM56314 | Mar 2007 | 0.75 Mbyte | 48 Gb/s | |
Broadcom Trident+ | Mar 2010 | 9 Mbyte | 40 nM | 0.64 Tb/s |
Broadcom Trident II | Aug 2012 | 12 Mbyte | 40 nM | 1.28 Tb/s |
Cisco Algoboost | Sep 2012 | 18 Mbyte | 480 Gb/s | |
Cisco UADP 1.0 | Jan 2013 | 6 Mbyte | 36 nM | 56 Gb/s |
Cavium Xpliant | Sep 2014 | 24 Mbyte | 28 nM | 3.2 Tbps |
Broadcom Tomahawk | Sep 2014 | 4 x 4 Mbyte | 28 nM | 3.2 Tbps |
Broadcom Trident II+ | Apr 2015 | 16 Mbyte | 28 nM | 1.28 Tb/s |
Mellanox Spectrum | June 2015 | 16 Mbyte | 28 nM | 6.4 Tbps |
Ciso Nexus LSE | Mar 2016 | 2 x 20 Mbyte | 16 nM | 3.6 Tbps |
Barefoot Tofino | June 2016 | 22 Mbyte | 16 nM | 6.4 Tbps |
Broadcom Tomahawk-II | Oct 2016 | 4 x 10.5 Mbyte | 16 nM | 6.4 Tbps |
Innovium Teralynx 7 | Mar 2017 | 70 Mbyte | 16 nM | 12.8 Tbps |
Broadcom Trident III | June 2017 | 32 Mbyte | 16 nM | 3.2 Tbps |
Cisco UADP 2.0 | June 2017 | 2 x 16 Mbyte | 28 nM | 240 Gb/s |
Mellanox Spectrum2 | July 2017 | 42 Mbyte | 16 nM | 6.4 Tb/s |
Broadcom Tomahawk-3 | Dec 2017 | 64 Mbyte | 16 nM | 12.8 Tbps |
Cisco UADP 3.0 | Mar 2018 | 36 Mbyte | 16 nM | 1.6 Tbps |
Intel Tofino2 | Dec 2018 | 64 Mbyte | 7 nM | 12.4 Tbps |
Broadcom Trident 4 | June 2019 | 132 Mbyte | 7 nM | 25.6 Tbps |
Broadcom Tomahawk 4 | Dec 2019 | 116 Mbyte | 7 nM | 25.6 Tbps |
Cisco One Q100 | Dec 2019 | HBM | 16 nM | 10.8 Tbps |
Nvidia/Mellanox Spectrum3 | Mar 2020 | 64 Mbyte | 16 nM | 12.8 Tbps |
Innovium Terelynx 8 | May 2020 | 170 Mbyte | 7 nM | 25.6 Tbps |
Cisco Nexus GX2B | June 2020 | 2 x 50 Mbyte | 7 nM | 25.6 Tbps |
Cisco Nexus GX2A | June 2020 | 4 x 25 Mbyte | 7 nM | 25.6 Tbps |
Another way to look at this is in https://en.wikipedia.org/wiki/Semiconductor_device_fabrication. From that reference, the history of device fabrication is: |
Semiconductor | |
device | |
fabrication | |
10000 nm | 1971 |
6000 nm | 1974 |
3000 nm | 1977 |
1500 nm | 1981 |
1000 nm | 1984 |
800 nm | 1987 |
600 nm | 1990 |
350 nm | 1993 |
250 nm | 1996 |
180 nm | 1999 |
130 nm | 2001 |
90 nm | 2003 |
65 nm | 2005 |
45 nm | 2007 |
32 nm | 2009 |
22 nm | 2012 |
14 nm | 2014 |
10 nm | 2016 |
7 nm | 2018 |
5 nm | 2020 |